One sentence summary – AMD has developed the AMD Versal AI Edge chip, a radiation-tolerant, space-grade technology that is the first adaptive system-on-chip (SoC) designed specifically for space applications, offering a compact form-factor, power savings of nearly 75%, and enhanced AI capabilities optimized for machine learning applications, with flight-qualified parts expected to be available by late 2024.
At a glance
- AMD has developed the AMD Versal AI Edge chip, a radiation-tolerant, space-grade technology.
- The chip is a complete system-on-chip (SoC) and is qualified for space flight.
- The Versal AI Edge chip is the first adaptive SoC designed specifically for space applications.
- It has a compact form-factor of 23 millimeters squared and offers power savings of nearly 75% compared to the existing Versal AI Core chip.
- The chip integrates the enhanced AMD AI Engine (AIE) technology known as AIE-ML, optimized for machine learning applications.
The details
AMD has developed a new chip, the AMD Versal AI Edge, which is a radiation-tolerant, space-grade technology.
This chip is a complete system-on-chip (SoC) and is qualified for space flight.
The Versal AI Edge chip is the first adaptive SoC designed specifically for space applications.
It has a compact form-factor of 23 millimeters squared.
Compared to the existing Versal AI Core chip, the Versal AI Edge chip has a significantly smaller board area.
It also offers power savings of nearly 75%.
The chip integrates the enhanced AMD AI Engine (AIE) technology known as AIE-ML.
AIE-ML is optimized for machine learning (ML) applications.
The technology offers extended support for prevalent data types in ML inferencing, such as INT4 and BFLOAT16.
This allows the chip to efficiently process and analyze data for various ML applications.
The Versal AI Edge chip is a field programmable gate array (FPGA).
It can be easily reprogrammed in the field, providing flexibility for different mission requirements.
The chip also incorporates robust security features.
These features prevent tampering and unwanted configuration changes.
This ensures the integrity of the chip’s operations.
AMD has thoroughly tested the radiation tolerance of the chip in collaboration with independent organizations.
This testing confirms the chip’s ability to withstand radiation encountered during space missions.
The chip is suitable for a range of orbits from low-earth orbit to geosynchronous earth orbit and beyond.
Commercial pre-production devices of the Versal AI Edge chip are currently available.
Flight-qualified parts are expected to be ready for deployment by late 2024.
This advancement in space-grade technology opens up new possibilities for AI and machine learning applications in space missions.
It provides improved performance, power efficiency, and adaptability.
Please note that the information provided is based on the generated bullet points and may require further verification from reliable sources.
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venturebeat.com |
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– AMD has developed the AMD Versal AI Edge chip, a radiation-tolerant, space-grade technology. – |
The chip is a complete system-on-chip (SoC) and is qualified for space flight. – |
The Versal AI Edge chip is the first adaptive SoC designed specifically for space applications and has a compact form-factor of 23 millimeters squared. – |
Compared to the existing Versal AI Core chip, the Versal AI Edge chip has a significantly smaller board area and power savings of nearly 75%. – |
The chip integrates the enhanced AMD AI Engine (AIE) technology known as AIE-ML, which is optimized for machine learning (ML) applications. – |
The AIE-ML technology offers extended support for prevalent data types in ML inferencing, such as INT4 and BFLOAT16. – |
The chip is a field programmable gate array (FPGA) and can be easily reprogrammed in the field. – |
The Versal Adaptive SoC incorporates robust security features to prevent tampering and unwanted configuration changes. – AMD has thoroughly tested the radiation tolerance of the chip in collaboration with independent organizations. – |
The chip is capable of supporting missions from low-earth orbit to geosynchronous earth orbit and beyond. – Commercial pre-production devices are currently available, and flight-qualified parts are expected to be ready for deployment by late 2024. |